HLLGA31, thermal enhanced low profile land grid array package, 31 terminals, 1 mm pitch, 10 mm x 8 mm x 1.365 mm body SOT2018-1 HLLGA31, thermal enhanced low profile land grid array package, 31
HLLGA31, thermal enhanced low profile land grid array package, 31 terminals, 1 mm pitch, 10 mm x 8 mm x 1.365 mm body SOT2018-1 HLLGA31, thermal enhanced low profile land grid array package, 31
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
---|---|---|---|---|---|---|---|---|
3-350820-2 | 1 | TE Connectivity | ULTRAFAST 250 ASSY REC 16-14 TPBR LP |
ECAD模型 下载ECAD模型 |
|
$0.3 | 查看 | |
MS75085-14RU | 1 | Vishay Intertechnologies | General Fixed Inductor, 1 ELEMENT, 390 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, AXIAL LEADED |
|
|
暂无数据 | 查看 | |
BT148W-600R,115 | 1 | NXP Semiconductors | BT148W-600R |
|
|
$0.46 | 查看 |
01/22 09:54
01/22 09:50
01/22 09:27
01/22 09:24
01/22 09:21
01/16 10:43
01/10 14:26
01/09 18:37
01/08 18:39
01/08 18:34
01/08 18:31
01/08 18:26
01/08 17:56
01/05 14:15
01/05 14:06
01/05 13:59
01/05 13:48
01/05 13:45
01/05 13:41
01/05 13:39