This document outlines the differences between silicon revisions 1.x and 3.x with respect to software, hardware, internal module revision, and chip pin assignment. It also provides information
This document outlines the differences between silicon revisions 1.x and 3.x with respect to software, hardware, internal module revision, and chip pin assignment. It also provides information
器件型号 | 数量 | 器件厂商 | 器件描述 | 数据手册 | ECAD模型 | 风险等级 | 参考价格 | 更多信息 |
---|---|---|---|---|---|---|---|---|
GRM21BR61E226ME44L | 1 | Murata Manufacturing Co Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, X5R, 15% TC, 22uF, Surface Mount, 0805, CHIP |
ECAD模型 下载ECAD模型 |
|
$0.38 | 查看 | |
1-66255-2 | 1 | TE Connectivity | 1.4mm2, COPPER ALLOY, TIN FINISH, WIRE TERMINAL, ROHS COMPLIANT |
|
|
$2.53 | 查看 | |
8PCV-03-006 | 1 | TE Connectivity | 30A, BARRIER STRIP TERMINAL BLOCK, 1 ROW, 1 DECK, ROHS COMPLIANT |
ECAD模型 下载ECAD模型 |
|
$4.86 | 查看 |
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